Exothermic Reaction Kinetics in High Energy Density Al-Ni with Nanoscale Multilayers Synthesized by Cryomilling
نویسندگان
چکیده
منابع مشابه
Reaction of Al/Ni Multilayers
Sputtered reactive multilayers applied as a heat source in electronic joining processes are 11 an emerging technology. It promises low-stress assembly of components while improving the 12 thermal contact and thus thermal resistance. The use of nanostructures can significantly enhance 13 the adhesion and reliability of joints between different materials. This work presents a 14 phenomenological ...
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Self-propagating exothermic formation reactions have been intensively studied in a variety of reactive multilayer foils, such as Ni/Al, Ni/Si, and Nb/Si foils. These foils contain numerous alternating nanoscale layers of elements with large negative heats of mixing. With a small thermal pulse, atoms diffuse normal to the layering and result in a rapid exothermic reaction. The heat produced is c...
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Microcompression tests were performed on the Al/Nb multilayers of incoherent interfaces with the layer thicknesses of 5 nm Al/5 nm Nb and 50 nm Al/50 nm Nb. The Al-Nb multilayers showed increase in strength as the layer thickness was reduced; the average flow stresses at 5% plastic strain from the 5 nm Al/5 nm Nb and 50 nm Al/50 nm Nb layer thickness specimens were determined to be 2.1 GPa and ...
متن کاملDensity fingering of an exothermic autocatalytic reaction.
Density fingering of exothermic autocatalytic fronts in vertically oriented porous media and Hele-Shaw cells is studied theoretically for chemical reactions where the solutal and thermal contribution to density changes have opposite signs. The competition between these two effects leads to thermal plumes for ascending fronts. The descending fronts behave strikingly differently as they can featu...
متن کاملInfluence of Nanoscaled Surface Modification on the Reaction of Al/Ni Multilayers
Sputtered reactive multilayers applied as a heat source in electronic joining processes are an emerging technology. Their use promises low-stress assembly of components while improving thermal contact and reducing thermal resistance. Nanostructured surface modifications can significantly enhance adhesion and reliability of joints between different materials. This work examines reactive multilay...
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ژورنال
عنوان ژورنال: Metals
سال: 2018
ISSN: 2075-4701
DOI: 10.3390/met8020121